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Traditional uses of silicon involve creating pathways for electricity within components such as integrated circuits. In contrast, MEMS transforms silicon into mechanically moving parts. During the past decade, this process has become useful in an increasing number of industries. For example, the automotive market uses MEMS accelerometers to sense crashes and deploy airbags.
Our research in MEMS led to the introduction of the world's first surface mount microphone in 2001 to 2002, the SiSonic series. We have since helped major brands design breakthrough cell phone and consumer electronics products, while eliminating the cost of traditional offline ECM microphone subassemblies.
高质量音频采集 Hear the Differences
全球各地的设计工程师正越来越了解ADI公司创新性iMEMS技术的强大能力。从最初的运动传感器,到现在的iMEMS麦克风,这推动着iMEMS技术在数百项尖端应用中得以实现。
iMEMS 麦克风结合了20年的MEMS技术诀窍与ADI公司音频信号处理专业技术,能够提供无与伦比的性能与可靠性。iMEMS模拟与数字输出麦克风具有61dB 的SNR(A-weighted),以及从100Hz到大于12kHz的平坦度响应,可提供出色的音频采集性能,满足下一代音频需求。
Surface Mount MEMS Microphones
· New MaxRF models eliminate GSM/TDMA burst noise and provide wide-band RF noise suppression
· UtlraMini footprint - less than 11.5mm2 (SPU Series)
· Slim UltraMini footprint - less than 8.5mm2 (SPQ Series)
· Digital mics eliminate analog noise
· Integrated designs with differential or switchable gain
· "Zero height" for thinnest ever designs
SiSonic MEMS Microphone
Built on our CMOS/MEMS technology platform (originally launched in 2002), the SiSonic silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 800 million units to date. The proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.
Design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. For manufacturers, surface mount designs eliminate off-line subassembly production costs. Customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing.
The microphones can also be integrated with our patented IntelliSonic software and special porting designs to provide a precisely customized sound.
Features
· Silicon structure for high degree of manufacturing repeatability and stable (predictable) acoustic performance
· Patented "free-floating" diaphragm is immune to shifts in microphone sensitivity caused by variable mechanical tension in traditional electret condenser microphone diaphragms
· Low mass, low size diaphragm produces excellent vibration sensitivity performance
· Excellent RFI and EMI suppression
· Excellent operating and storage temperature ratings -40C to 100C
· Versatile configuration and sound porting options for future microphone enhancements
· 45% less board space than 6x2.2 ECMs
· 30% lower profile height than ECMs
· RoHS Compliant and Halogen Free
· Highly shock resistant
· Ideally suited for high volume applications
我继续做反方,楼上朋友别介意啊:(能和wdele这样斑竹级的高手讨论,我荣幸之至 啊!呵呵,继续讨论。)
学习了
关于硅麦克风有如下观点:
1\现在的硅麦克风和十年前的普通ECM一样高价,原因主要是K厂的专利封 锁,造成芯片无法大量生产,所以芯片价格高,硅麦克风肯定价高,现在K厂到处象疯 狗一样告人,先是国内某厂,后来是韩国某厂的合作伙伴,而且基本全部胜诉.现在K厂也在当被告,期待结果......国内的麦克风工厂暂时只有养 兵千日了.K厂也因为自己的封锁造成自己也无法增加出货量了,因为他作为唯一供应商的时候,别人也不敢用他的东西了.
2\硅麦克风有他的好处,主要还是可以利用成熟的半导体设备实现真正的自动化生产,半导体封装设备虽然贵,但是效率高,非现在ECM的自动化设备所能项背.当然也会有工艺问题.
3\将来麦克风的中高端市场应该是数字硅麦克风的,传统模拟贵麦克风应该只是过渡.